5 - 7 October 2021
Physical Electronics GmbH
Surface Analysis techniques help you to understand the composition of the outer most atomic layers of a material which plays a critical role in properties such as: chemical activity, adhesion, wettability, electrostatic behavior, corrosion resistance, bio-compatibility, etc. XPS, TOF-SIMS and AES are the classical surface analysis techniques. They detect electrons or ions emitted from the surface using different excitation beams. Typical is the characterization and imaging of chemical and elemental composition. The ability to characterize thin film structures, via sputter depth profiling, provides a unique opportunity to examine the materials used in thin layers and to study their interaction with materials in adjacent layers. All Surface Analysis techniques require ultra-high vacuum. Different methods are available for surface analysis. X-ray Photoelectron Spectroscopy (XPS) also known as Electron Spectroscopy for Chemical Analysis (ESCA) is the most widely used surface analysis technique because it can be applied to a broad range of materials and provides valuable quantitative and chemical state information from the surface of the material being studied. The average depth of analysis for an XPS measurement is approximately 5 nm. Time-of-Flight Secondary Ion Mass Spectrometry (TOF-SIMS) provides elemental, chemical state, and molecular information from surfaces of solid materials. The average depth of analysis for a TOF-SIMS measurement is approximately 1 nm. Auger Electron Spectroscopy (AES) provides quantitative elemental and chemical state information from surfaces of solid materials. The average depth of analysis for an AES measurement is approximately 5 nm.
Unique combination of surface analysis methods, XPS, TOF-SIMS and AES. If routine analysis is no longer helpful, then our service will be valuable for you. We operate ...